Recently added

The European Green Deal and nephrology: a call for action by the European Kidney Health Alliance

Vanholder, Raymond; Agar, John; Braks, Marion; Gallego, Daniel; Gerritsen, Karin G. F.; Harber, Mark; Noruisiene, Edita; Pancirova, Jitka; Piccoli, Giorgina B.; Stamatialis, Dimitrios; Wieringa, Fokko (2023)

In silico screening for As/Se-free ovonic threshold switching materials

Clima, Sergiu; Matsubayashi, Daisuke; Ravsher, Taras; Garbin, Daniele; Delhougne, Romain; Kar, Gouri Sankar; Pourtois, Geoffrey (2023)

Are Randomized Caches Truly Random? Formal Analysis of Randomized-Partitioned Caches

Chakraborty, Anirban; Bhattacharya, Sarani; Saha, Sayandeep; Mukhopadhyay, Debdeep (2023)

Spin Seebeck effect mediated reversal of vortex-Nernst effect in superconductor-ferromagnet bilayers

Sharma, Himanshu; Wen, Zhenchao; Mizuguchi, Masaki (2023)

JPEG Pleno holography presents the numerical reconstruction software for holograms: an excursion in holographic views

Birnbaum, Tobias; Kizhakkumkara Muhamad, Raees; Perra, Cristian; Gilles, Antonin; Blinder, David; Kozacki, Tomasz; Schelkens, Peter (2023)

Benchmarking First-Principles Reaction Equilibrium Composition Prediction

Marques, Esteban; De Gendt, Stefan; Pourtois, Geoffrey; van Setten, Michiel (2023)

Improvement of absorbing stability of carbon nanofibers in sub-terahertz domain using the surface modification of zinc oxide

Chen, Cheng; Zhao, Wu; Zhang, Huiyao; Hauffman, Tom; Zhang, Zhiyong; Stiens, Johan (2023)

Large-scale nano-biosensing technologies

Tzouvadaki, Ioulia; Prodromakis, Themis (2023)

The Editorial

Dusa, Mircea (2023)

Scaling-friendly approaches to minimize the magnitude and asymmetry of wafer warpage during 3-D NAND fabrication

Okudur, Oguzhan Orkut; Gonzalez, Mario; Van den Bosch, Geert; Rosmeulen, Maarten (2023)

Multi-Criteria Coordinated Electric Vehicle-Drone Hybrid Delivery Service Planning

Cho, Young Hoo; Baek, Donkyu; Chen, Yukai; Jung, Min Jae; Vinco, Sara; Macii, Enrico; Poncino, Massimo (2023)

Growth mechanisms of interfacial carbon layers at the epitaxial Al2O3(0001)/Cu(111) interface as application for epitaxial film lift-off

Tsai, Hung-Chieh; Marien, Brecht; Chancerel, Francois; De Gendt, Stefan; Brems, Steven (2023)

Comphy v3.0-A compact-physics framework for modeling charge trapping related reliability phenomena in MOS devices

Waldhoer, Dominic; Schleich, Christian; Michl, Jakob; Grill, Alexander; Claes, Dieter; Karl, Alexander; Knobloch, Theresia; Rzepa, Gerhard; Franco, Jacopo; Kaczer, Ben; Waltl, Michael; Grasser, Tibor (2023)

Challenges in introducing high-density interconnect technology in printed circuit boards for space applications

Cauwe, Maarten; Vandevelde, Bart; Nawghane, Chinmay; Van de Slyeke, Marnix; Coulon, Alexia; Heltzel, Stan (2023)

Advanced PCB technologies for space and their assessment using up-to-date standards

Heltzel, Stan; Cauwe, Maarten; Bennett, Joe; Rohr, Thomas (2023)

Development of a Microfluidic Chip Powered by EWOD for In Vitro Manipulation of Bovine Embryos

Karcz, Adriana; Van Soom, Ann; Smits, Katrien; Van Vlierberghe, Sandra; Verplancke, Rik; Pascottini, Osvaldo Bogado; van den Abbeel, Etienne; Vanfleteren, Jan (2023)

The impact of electron phonon scattering on transport properties of topological insulators: A first principles quantum transport study

Akhoundi, Elaheh; Houssa, Michel; Afzalian, Aryan (2023)

Screen-printed graphene tailoring the amplitude of guided wave in the rectangular waveguide for millimeter wave applications

He, Guoqiang; Lu, Yu; Xu, Tao; Pinto, Artur M.; Stiens, Johan; Friedrich, Heiner (2023)

Towards material and process agnostic features for the classification of pore types in metal additive manufacturing

Vandecasteele, Mathieu; Heylen, Rob; Luso, Domenico; Thanki, Aditi; Philips, Wilfried; Witvrouw, Ann; Verhees, Dries; Booth, Brian (2023)

84%-Efficiency Fully Integrated Voltage Regulator for Computing Systems Enabled by 2.5-D High-Density MIM Capacitor

Lin, Hesheng; Velenis, Dimitrios; Nolmans, Philip; Sun, Xiao; Catthoor, Francky; Lauwereins, Rudy; Van der Plas, Geert; Beyne, Eric (2022)

imec Publications: Recent submissions

The European Green Deal and nephrology: a call for action by the European Kidney Health Alliance ﻿

In silico screening for As/Se-free ovonic threshold switching materials ﻿

Are Randomized Caches Truly Random? Formal Analysis of Randomized-Partitioned Caches ﻿

Spin Seebeck effect mediated reversal of vortex-Nernst effect in superconductor-ferromagnet bilayers ﻿

JPEG Pleno holography presents the numerical reconstruction software for holograms: an excursion in holographic views ﻿

Benchmarking First-Principles Reaction Equilibrium Composition Prediction ﻿

Improvement of absorbing stability of carbon nanofibers in sub-terahertz domain using the surface modification of zinc oxide ﻿

Large-scale nano-biosensing technologies ﻿

The Editorial ﻿

Scaling-friendly approaches to minimize the magnitude and asymmetry of wafer warpage during 3-D NAND fabrication ﻿

Multi-Criteria Coordinated Electric Vehicle-Drone Hybrid Delivery Service Planning ﻿

Growth mechanisms of interfacial carbon layers at the epitaxial Al2O3(0001)/Cu(111) interface as application for epitaxial film lift-off ﻿

Comphy v3.0-A compact-physics framework for modeling charge trapping related reliability phenomena in MOS devices ﻿

Challenges in introducing high-density interconnect technology in printed circuit boards for space applications ﻿

Advanced PCB technologies for space and their assessment using up-to-date standards ﻿

Development of a Microfluidic Chip Powered by EWOD for In Vitro Manipulation of Bovine Embryos ﻿

The impact of electron phonon scattering on transport properties of topological insulators: A first principles quantum transport study ﻿

Screen-printed graphene tailoring the amplitude of guided wave in the rectangular waveguide for millimeter wave applications ﻿

Towards material and process agnostic features for the classification of pore types in metal additive manufacturing ﻿

84%-Efficiency Fully Integrated Voltage Regulator for Computing Systems Enabled by 2.5-D High-Density MIM Capacitor ﻿