Recently added

A Survey on Memory-centric Computer Architectures

Gebregiorgis, Anteneh; Hoang Anh Du Nguyen; Yu, Jintao; Bishnoi, Rajendra; Taouil, Mottaqiallah; Catthoor, Francky; Hamdioui, Said (2022)

Single-cell transfection technologies for cell therapies and gene editing

Duckert, Bastien; Vinkx, Steven; Braeken, Dries; Fauvart, Maarten (2021)

U-Groove Assisted Passive Assembly of 30x Single-Mode Fiber Array to Edge Couplers for Silicon Photonics

He, Junwen; Lepage, Guy; Yilmaz, Ozan; Verheyen, Peter; Miller, Andy; Pantouvaki, Marianna; Van Campenhout, Joris (2021)

Thin silicon layer as heat channel for low-loss SiN tunable devices

Caer, Charles; Dwivedi, Sarvagya Paavan (2021)

The unique properties of SiCN as bonding material for hybrid bonding

Iacovo, Serena; Kim, Soon-Wook; Nagano, Fuya; Peng, Lan; Inoue, Fumihiro; Phommahaxay, Alain; Beyne, Eric (2021)

The Burgers equations and the Born rule

Prodanov, Dimiter (2021)

TCAD study of latch-up sensitivity to wafer thinning below 500 nm

Hiblot, Gaspard; Serbulova, Kateryna; Hellings, Geert; Chen, Shih-Hung (2021)

Realization of Fabrication-Tolerant Si3N4-Si Mode Transformers

De Witte, Jasper; Cuyvers, Stijn; Poelman, Stijn; Kuyken, Bart; Van Thourhout, Dries (2021)

METALIZED SOFT POLYMERS FOR ELECTROMECHANICAL TRANSDUCERS ON GLASS SUBSTRATES

Liang, Boshen; Keulemans, Grim; Wysocka, Dominika; Zhang, Lei; Rochus, Veronique; Stakenborg, Tim; Heremans, Paul; Cheyns, David (2021)

Metal induced charge transfer doping in graphene-ruthenium hybrid interconnects

Achra, Swati; Wu, Xiangyu; Trepalin, Vadim; Nuytten, Thomas; Ludwig, Jonathan; Afanas'ev, Valeri; Brems, Steven; Soree, Bart; Tokei, Zsolt; Heyns, Marc; Asselberghs, Inge (2021)

Linearity Assessment of GaN HEMTs on Si using Nonlinear Characterisation

ElKashlan, Rana Y.; Khaled, Ahmad; Rodriguez, Raul; Putcha, Vamsi; Peralagu, Uthayasankaran; Alian, AliReza; Collaert, Nadine; Wambacq, Piet (2021)

Laser-fabricated ball lens optical interface for back side coupling to a silicon photonics sensor chip

Missinne, Jeroen; Geudens, Viktor; Mattelin, Marie; Poulopoulos, Giannis; Zervos, Charalampos; Avramopoulos, Hercules; Szaj, Michal; Van Steenberge, Geert (2021)

Joule heating investigation for advanced interconnect schemes with airgaps

Lofrano, Melina; Varela Pedreira, Olalla; Ciofi, Ivan; Oprins, Herman; Park, Seongho; Tokei, Zsolt (2021)

Investigation on Low-temperature Temporary Bonding for Microfluidic Devices in Lifescience Applications

Han, Yang; Dang Thi Thuy, Chi; Visker, Evert; Visker, Jakob; Humbert, Aurelie; Peng, Lan (2021)

Integration on a microchip: A glimpse into the future of optical coherence tomography

Akca, B. Imran; Chang, Lantian; Yurtsever, Gunay (2021)

Integrating Frequency Translational Invariance in TDNNs and Frequency Positional Information in 2D ResNets to Enhance Speaker Verification

Thienpondt, Jenthe; Desplanques, Brecht; Demuynck, Kris (2021)

Indoor Direct Positioning With Imperfect Massive MIMO Array Using Measured Near-Field Channels

Pan, Yujian; De Bast, Sibren; Pollin, Sofie (2021)

iN5 EUV Single Expose Patterning Evaluation for Via Layers

Das, Argho; Blanco, Victor; Das, Sayantan; Kissoon, Nicola; Halder, Sandip; Dusa, Mircea (2021)

Improved depth information from routine analysis of the inelastic background of XPS and HAXPES spectra using optimized two- and three-parameter cross-sections

Zborowski, Charlotte; Tougaard, Sven (2022)

Impact of mask corner rounding on pitch 40 nm contact hole variability

van Look, Lieve; Gillijns, Werner; Gallagher, Emily (2021)

imec Publications: Recent submissions

A Survey on Memory-centric Computer Architectures ﻿

Single-cell transfection technologies for cell therapies and gene editing ﻿

U-Groove Assisted Passive Assembly of 30x Single-Mode Fiber Array to Edge Couplers for Silicon Photonics ﻿

Thin silicon layer as heat channel for low-loss SiN tunable devices ﻿

The unique properties of SiCN as bonding material for hybrid bonding ﻿

The Burgers equations and the Born rule ﻿

TCAD study of latch-up sensitivity to wafer thinning below 500 nm ﻿

Realization of Fabrication-Tolerant Si3N4-Si Mode Transformers ﻿

METALIZED SOFT POLYMERS FOR ELECTROMECHANICAL TRANSDUCERS ON GLASS SUBSTRATES ﻿

Metal induced charge transfer doping in graphene-ruthenium hybrid interconnects ﻿

Linearity Assessment of GaN HEMTs on Si using Nonlinear Characterisation ﻿

Laser-fabricated ball lens optical interface for back side coupling to a silicon photonics sensor chip ﻿

Joule heating investigation for advanced interconnect schemes with airgaps ﻿

Investigation on Low-temperature Temporary Bonding for Microfluidic Devices in Lifescience Applications ﻿

Integration on a microchip: A glimpse into the future of optical coherence tomography ﻿

Integrating Frequency Translational Invariance in TDNNs and Frequency Positional Information in 2D ResNets to Enhance Speaker Verification ﻿

Indoor Direct Positioning With Imperfect Massive MIMO Array Using Measured Near-Field Channels ﻿

iN5 EUV Single Expose Patterning Evaluation for Via Layers ﻿

Improved depth information from routine analysis of the inelastic background of XPS and HAXPES spectra using optimized two- and three-parameter cross-sections ﻿

Impact of mask corner rounding on pitch 40 nm contact hole variability ﻿