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MEMS packaging and integration for miniaturized sensor nodes

dc.contributor.authorBaert, Kris
dc.contributor.authorVan Hoof, Chris
dc.date.accessioned2021-10-16T00:43:29Z
dc.date.available2021-10-16T00:43:29Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10045
dc.sourceIIOimport
dc.titleMEMS packaging and integration for miniaturized sensor nodes
dc.typeOral presentation
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.orcidimecVan Hoof, Chris::0000-0002-4645-3326
dc.source.peerreviewno
dc.source.conferenceSemicon Europe International MEMS/MST Industry Forum
dc.source.conferencedate11/04/2005
dc.source.conferencelocationMünchen Germany
imec.availabilityPublished - imec


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