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On-chip and in-package thin-film passive component integration

dc.contributor.authorCarchon, Geert
dc.date.accessioned2021-10-16T00:52:34Z
dc.date.available2021-10-16T00:52:34Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10177
dc.sourceIIOimport
dc.titleOn-chip and in-package thin-film passive component integration
dc.typeOral presentation
dc.source.peerreviewno
dc.source.conferenceIEEE MTT-S Workshop
dc.source.conferencedate12/06/2005
dc.source.conferencelocationLong Beach, CA USA
imec.availabilityPublished - imec


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