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Die requirements for 3D integration

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-16T15:04:56Z
dc.date.available2021-10-16T15:04:56Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11733
dc.sourceIIOimport
dc.titleDie requirements for 3D integration
dc.typeOral presentation
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conferenceCAST Workshop: Challenges on Advanced Semiconductor-Die Technologies
dc.source.conferencedate25/06/2007
dc.source.conferencelocationPortsmouth UK
imec.availabilityPublished - imec


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