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Strain engineering and device performance: benefit or compromise?

dc.contributor.authorClaeys, Cor
dc.contributor.authorSimoen, Eddy
dc.date.accessioned2021-10-16T15:20:00Z
dc.date.available2021-10-16T15:20:00Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11879
dc.sourceIIOimport
dc.titleStrain engineering and device performance: benefit or compromise?
dc.typeOral presentation
dc.contributor.imecauthorSimoen, Eddy
dc.contributor.orcidimecSimoen, Eddy::0000-0002-5218-4046
dc.source.peerreviewno
dc.source.conferenceIEEE Electron and Devices Colloquium on Next generation Device Technologies
dc.source.conferencedate23/02/2007
dc.source.conferencelocationSanta Clara, CA USA
imec.availabilityPublished - imec


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