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Mechanical and physical behaviour of intermetallics in leadfree flip chip interconnections

dc.contributor.authorLabie, Riet
dc.date.accessioned2021-10-16T17:13:51Z
dc.date.available2021-10-16T17:13:51Z
dc.date.issued2007-05
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12425
dc.sourceIIOimport
dc.titleMechanical and physical behaviour of intermetallics in leadfree flip chip interconnections
dc.typePHD thesis
dc.contributor.imecauthorLabie, Riet
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.contributor.thesisadvisorVan Humbeeck, J.
dc.contributor.thesisadvisorMertens, Robert
imec.availabilityPublished - open access


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