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A high-reliable Cu/ULK integration scheme using Metal Hard Mask and Low-k capping film

dc.contributor.authorTravaly, Youssef
dc.contributor.authorTsutsue, M.
dc.contributor.authorIkeda, Atsushi
dc.contributor.authorVerdonck, Patrick
dc.contributor.authorTokei, Zsolt
dc.contributor.authorWillegems, Myriam
dc.contributor.authorVan Aelst, Joke
dc.contributor.authorStruyf, Herbert
dc.contributor.authorVereecke, Guy
dc.contributor.authorKesters, Els
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorClaes, Martine
dc.contributor.authorHeylen, Nancy
dc.contributor.authorSinapi, Fabrice
dc.contributor.authorRichard, Olivier
dc.contributor.authorDe Roest, David
dc.contributor.authorKaneko, S
dc.contributor.authorKemeling, N
dc.contributor.authorFukazawa, A
dc.contributor.authorMatsuki, N
dc.contributor.authorMatsushita, K
dc.contributor.authorTsuji, N
dc.contributor.authorKagami, K
dc.contributor.authorSprey, Hessel
dc.contributor.authorBeyer, Gerald
dc.date.accessioned2021-10-16T20:16:17Z
dc.date.available2021-10-16T20:16:17Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12990
dc.sourceIIOimport
dc.titleA high-reliable Cu/ULK integration scheme using Metal Hard Mask and Low-k capping film
dc.typeOral presentation
dc.contributor.imecauthorVerdonck, Patrick
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorWillegems, Myriam
dc.contributor.imecauthorVan Aelst, Joke
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorClaes, Martine
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorRichard, Olivier
dc.contributor.imecauthorDe Roest, David
dc.contributor.imecauthorSprey, Hessel
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecRichard, Olivier::0000-0002-3994-8021
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conferenceAdvanced Metallization Conference: 17th Asian Session
dc.source.conferencedate22/10/2007
dc.source.conferencelocationTokyo Japan
imec.availabilityPublished - open access


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