Show simple item record

3D systems-in-a-package for wireless sensor nodes

dc.contributor.authorVan Hoof, Chris
dc.date.accessioned2021-10-16T20:41:13Z
dc.date.available2021-10-16T20:41:13Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13059
dc.sourceIIOimport
dc.title3D systems-in-a-package for wireless sensor nodes
dc.typeOral presentation
dc.contributor.imecauthorVan Hoof, Chris
dc.source.peerreviewno
dc.source.conferenceInternational Solid-State Circuits Conference - ISSCC
dc.source.conferencedate11/02/2007
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record