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The evaluation and the inegration of low-k organic spin-on materials in a non-etchback interconnect process

dc.contributor.authorMeynen, Herman
dc.contributor.authorWaeterloos, Joost
dc.contributor.authorCoenegrachts, Bart
dc.contributor.authorGao, Teng
dc.contributor.authorGrillaert, Joost
dc.contributor.authorVan den hove, Luc
dc.date.accessioned2021-09-29T15:13:39Z
dc.date.available2021-09-29T15:13:39Z
dc.date.issued1996
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/1351
dc.sourceIIOimport
dc.titleThe evaluation and the inegration of low-k organic spin-on materials in a non-etchback interconnect process
dc.typeOral presentation
dc.contributor.imecauthorCoenegrachts, Bart
dc.contributor.imecauthorVan den hove, Luc
dc.source.peerreviewno
dc.source.conferencePLANAR 96; June 17, 1996; Santa Clara, Calif., USA.
dc.source.conferencelocation
imec.availabilityPublished - imec


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