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K-sorbate as a passivator in copper chemical mechanical planarization (CMP) slurries

dc.contributor.authorNagar, Magi
dc.contributor.authorVaes, Jan
dc.contributor.authorEin Eli, Yair
dc.date.accessioned2021-10-17T09:16:01Z
dc.date.available2021-10-17T09:16:01Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14210
dc.sourceIIOimport
dc.titleK-sorbate as a passivator in copper chemical mechanical planarization (CMP) slurries
dc.typeOral presentation
dc.source.peerreviewno
dc.source.conference7th International Symposium on Electrochemical Micro & Nano-system Technologies - EMNT
dc.source.conferencedate15/09/2008
dc.source.conferencelocationEin-Gedi Israel
imec.availabilityPublished - imec


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