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Wafer bonding challenges for 3-D integration

dc.contributor.authorJourdain, Anne
dc.contributor.authorMiller, Andy
dc.contributor.authorSwinnen, Bart
dc.date.accessioned2021-10-18T17:25:22Z
dc.date.available2021-10-18T17:25:22Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17328
dc.sourceIIOimport
dc.titleWafer bonding challenges for 3-D integration
dc.typeOral presentation
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorSwinnen, Bart
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conferenceSemi Sematech Workshop
dc.source.conferencedate1/07/2010
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - open access


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