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Lead free solder joint in electronic applications: material behaviour and reliability

dc.contributor.authorLimaye, Paresh
dc.date.accessioned2021-10-18T18:19:31Z
dc.date.available2021-10-18T18:19:31Z
dc.date.issued2010-01
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17498
dc.sourceIIOimport
dc.titleLead free solder joint in electronic applications: material behaviour and reliability
dc.typePHD thesis
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.contributor.thesisadvisorVandepitte, Dirk
dc.contributor.thesisadvisorVerlinden, Albert
imec.availabilityPublished - open access


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