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TSV characterization and modeling

dc.contributor.authorStucchi, Michele
dc.contributor.authorKatti, Guruprasad
dc.contributor.authorVelenis, Dimitrios
dc.date.accessioned2021-10-19T19:20:20Z
dc.date.available2021-10-19T19:20:20Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19846
dc.sourceIIOimport
dc.titleTSV characterization and modeling
dc.typeBook chapter
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorVelenis, Dimitrios
dc.source.peerreviewno
dc.source.beginpage33
dc.source.bookThree Dimensional System Integration, IC Stacking Process and Design
dc.source.endpage49
imec.availabilityPublished - imec


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