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Electroless nickel-gold stud bumping on laminate for flip-chip assembly

dc.contributor.authorZang, S.
dc.contributor.authorVereecken, M.
dc.contributor.authorDe Baets, J.
dc.contributor.authorVan Calster, Andre
dc.contributor.authorVervaet, A.
dc.contributor.authorPeeters, Joris
dc.contributor.authorAllaert, K.
dc.date.accessioned2021-09-30T10:10:33Z
dc.date.available2021-09-30T10:10:33Z
dc.date.issued1997
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/2320
dc.sourceIIOimport
dc.titleElectroless nickel-gold stud bumping on laminate for flip-chip assembly
dc.typeOral presentation
dc.contributor.imecauthorVan Calster, Andre
dc.source.peerreviewno
dc.source.conferencePrinted Circuit Board Technology; January 1997; Berlin, Germany.
dc.source.conferencelocation
imec.availabilityPublished - imec


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