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Chip package interaction

dc.contributor.authorVandevelde, Bart
dc.date.accessioned2021-10-21T13:41:47Z
dc.date.available2021-10-21T13:41:47Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23287
dc.sourceIIOimport
dc.titleChip package interaction
dc.typeOral presentation
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.source.peerreviewno
dc.source.conferenceCohesie Workshop "From Electronic Building Blocks to Innovative Microsystems"
dc.source.conferencedate13/06/2013
dc.source.conferencelocationLeuven Belgium
imec.availabilityPublished - imec


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