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Recent packaging and board assembly challenges for high-reliabliity applications

dc.contributor.authorVandevelde, Bart
dc.date.accessioned2021-10-21T13:42:11Z
dc.date.available2021-10-21T13:42:11Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23288
dc.sourceIIOimport
dc.titleRecent packaging and board assembly challenges for high-reliabliity applications
dc.typeOral presentation
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.source.peerreviewno
dc.source.conferenceInemi Automotive Workshop
dc.source.conferencedate9/09/2013
dc.source.conferencelocationGrenoble France
imec.availabilityPublished - imec


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