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Cu TSV stress: avoiding Cu protrusion and impact on devices

dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorGuo, Wei
dc.date.accessioned2021-10-22T00:46:34Z
dc.date.available2021-10-22T00:46:34Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23547
dc.sourceIIOimport
dc.titleCu TSV stress: avoiding Cu protrusion and impact on devices
dc.typeBook chapter
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorGuo, Wei
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage365
dc.source.bookHandbook of 3D Integration, Volume 3: 3D Process Integration
dc.source.endpage378
dc.identifier.urlhttp://onlinelibrary.wiley.com/doi/10.1002/9783527670109.ch27/summary
imec.availabilityPublished - imec
imec.internalnotesCh. 27


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