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Thinning, via reveal and backside processing - overview

dc.contributor.authorBeyne, Eric
dc.contributor.authorJourdain, Anne
dc.contributor.authorPhommahaxay, Alain
dc.date.accessioned2021-10-22T00:46:38Z
dc.date.available2021-10-22T00:46:38Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23548
dc.sourceIIOimport
dc.titleThinning, via reveal and backside processing - overview
dc.typeBook chapter
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage191
dc.source.bookHandbook of 3D Integration, Volume 3: 3D Process technology
dc.source.endpage206
imec.availabilityPublished - imec
imec.internalnotesCh. 15


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