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Direct copper plating

dc.contributor.authorRadisic, Alex
dc.contributor.authorVereecken, Philippe
dc.date.accessioned2021-10-22T04:56:47Z
dc.date.available2021-10-22T04:56:47Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24412
dc.sourceIIOimport
dc.titleDirect copper plating
dc.typeBook chapter
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.source.peerreviewno
dc.source.beginpage131
dc.source.bookCopper Electrodeposition for Nanofabrication of Electronics Devices
dc.source.endpage173
dc.identifier.urlhttp://rd.springer.com/book/10.1007%2F978-1-4614-9176-7
imec.availabilityPublished - imec
imec.internalnotesISBN: 978-1-4614-9175-0 (Print) 978-1-4614-9176-7 (Online)


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