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The influence of plasma processes on EUV pattern roughness mitigation for future CMOS technologies

dc.contributor.authorDe Schepper, Peter
dc.date.accessioned2021-10-22T18:51:54Z
dc.date.available2021-10-22T18:51:54Z
dc.date.issued2015-04
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25149
dc.sourceIIOimport
dc.titleThe influence of plasma processes on EUV pattern roughness mitigation for future CMOS technologies
dc.typePHD thesis
dc.contributor.imecauthorDe Schepper, Peter
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.contributor.thesisadvisorDe Gendt, Stefan
imec.availabilityPublished - open access


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