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CMP processing of high-mobility channel material alternatives to Si

dc.contributor.authorOng, Patrick
dc.contributor.authorTeugels, Lieve
dc.date.accessioned2021-10-23T13:23:16Z
dc.date.available2021-10-23T13:23:16Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27096
dc.sourceIIOimport
dc.titleCMP processing of high-mobility channel material alternatives to Si
dc.typeBook chapter
dc.contributor.imecauthorOng, Patrick
dc.contributor.imecauthorTeugels, Lieve
dc.contributor.orcidimecOng, Patrick::0000-0002-2072-292X
dc.contributor.orcidimecTeugels, Lieve::0000-0002-6613-9414
dc.source.peerreviewno
dc.source.beginpage119
dc.source.bookAdvances in Chemical Mechanical Planarization (CMP)
dc.source.endpage136
imec.availabilityPublished - imec
imec.internalnotesWoodhead Series in Electronic and optical Materials; Vol. 86 ISBN 0081002181, 97800810021862016


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