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Testing & diagnosis of fine-pitch wafers and advanced packages

dc.contributor.authorFodor, Ferenc
dc.contributor.authorMarinissen, Erik Jan
dc.contributor.authorAcconcia, Daniele
dc.contributor.authorBertarelli, Emanuele
dc.contributor.authorVallauri, Raffaele
dc.date.accessioned2021-10-25T18:41:52Z
dc.date.available2021-10-25T18:41:52Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30715
dc.sourceIIOimport
dc.titleTesting & diagnosis of fine-pitch wafers and advanced packages
dc.typeOral presentation
dc.contributor.imecauthorFodor, Ferenc
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.source.peerreviewno
dc.source.conferenceSEMICON Taiwan
dc.source.conferencedate5/09/2018
dc.source.conferencelocationTaipei Taiwan
imec.availabilityPublished - imec


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