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BGA solder strain prediction using an Artificial Neural Network regressor

dc.contributor.authorFerrando Villalba, Pablo
dc.contributor.authorVandevelde, Bart
dc.date.accessioned2021-10-28T21:38:57Z
dc.date.available2021-10-28T21:38:57Z
dc.date.issued2020
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/35116
dc.sourceIIOimport
dc.titleBGA solder strain prediction using an Artificial Neural Network regressor
dc.typeProceedings paper
dc.contributor.imecauthorFerrando Villalba, Pablo
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.source.peerreviewyes
dc.source.conferenceInt. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE
dc.source.conferencedate6/07/2020
dc.source.conferencelocationKrakau Polen
imec.availabilityPublished - imec


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