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Study on Process Induced out-of-plane deformation for Fan-Out Wafer Level Packaging

dc.contributor.authorSalahouelhadj, Abdellah
dc.contributor.authorGonzalez, Mario
dc.contributor.authorPodpod, Arnita
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-12-08T10:50:11Z
dc.date.available2021-11-02T16:03:21Z
dc.date.available2021-12-08T10:50:11Z
dc.date.issued2020
dc.identifier.issnna
dc.identifier.otherWOS:000631824100062
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/38045.2
dc.sourceWOS
dc.titleStudy on Process Induced out-of-plane deformation for Fan-Out Wafer Level Packaging
dc.typeProceedings paper
dc.contributor.imecauthorSalahouelhadj, A.
dc.contributor.imecauthorGonzalez, M.
dc.contributor.imecauthorPodpod, A.
dc.contributor.imecauthorBeyne, E.
dc.contributor.imecauthorSalahouelhadj, Abdellah
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorPodpod, Arnita
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSalahouelhadj, Abdellah::0000-0002-3795-1446
dc.contributor.orcidimecGonzalez, Mario::0000-0003-4374-4854
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.identifier.eisbn978-1-7281-6293-5
dc.source.numberofpages5
dc.source.peerreviewyes
dc.source.conference8th IEEE Electronics System-Integration Technology Conference (ESTC)
dc.source.conferencedateSEP 15-18, 2020
dc.source.conferencelocationVestfold
dc.source.journalna
imec.availabilityPublished - imec


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220.500.12860/38045.2*2021-12-08T10:48:32Zvalidation by library/open access desk
120.500.12860/380452021-11-02T16:03:21Z

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