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Supervia Process Integration and Reliability Compared to Stacked Vias Using Barrierless Ruthenium

dc.contributor.authorVega-Gonzalez, V.
dc.contributor.authorPuliyalil, H.
dc.contributor.authorVersluijs, J.
dc.contributor.authorLesniewska, A.
dc.contributor.authorVarela-Pereira, O.
dc.contributor.authorBaert, R.
dc.contributor.authorPaolillo, S.
dc.contributor.authorDecoster, S.
dc.contributor.authorSchleicher, F.
dc.contributor.authorMontero, D.
dc.contributor.authorBekaert, J.
dc.contributor.authorKesters, E.
dc.contributor.authorLe, Q. T.
dc.contributor.authorLorant, C.
dc.contributor.authorTeugels, L.
dc.contributor.authorHeylen, N.
dc.contributor.authorJourdan, N.
dc.contributor.authorEl-Mekki, Z.
dc.contributor.authorvan der Veen, M.
dc.contributor.authorCiofi, I
dc.contributor.authorBriggs, B.
dc.contributor.authorHeijlen, J.
dc.contributor.authorDupas, L.
dc.contributor.authorDe-Wachter, B.
dc.contributor.authorVancoille, E.
dc.contributor.authorWebers, T.
dc.contributor.authorVats, H.
dc.contributor.authorRynders, L.
dc.contributor.authorCupak, M.
dc.contributor.authorUk-Lee, J.
dc.contributor.authorDrissi, Y.
dc.contributor.authorHalipre, L.
dc.contributor.authorCharley, A-L
dc.contributor.authorVerdonck, P.
dc.contributor.authorWitters, T.
dc.contributor.authorGompel, S., V
dc.contributor.authorKimura, Y.
dc.contributor.authorDemonie, I
dc.contributor.authorLazzarino, F.
dc.contributor.authorErcken, M.
dc.contributor.authorKim, R.
dc.contributor.authorTrivkovic, D.
dc.contributor.authorCroes, K.
dc.contributor.authorLeray, P.
dc.contributor.authorJaysankar, M.
dc.contributor.authorWilson, C.
dc.contributor.authorMuroch, G.
dc.contributor.authorTokei, Z.
dc.date.accessioned2021-12-06T02:06:16Z
dc.date.available2021-12-06T02:06:16Z
dc.date.issued2020
dc.identifier.issn2380-9248
dc.identifier.otherWOS:000717011600197
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/38538
dc.sourceWOS
dc.titleSupervia Process Integration and Reliability Compared to Stacked Vias Using Barrierless Ruthenium
dc.typeProceedings paper
dc.contributor.imecauthorVega-Gonzalez, V.
dc.contributor.imecauthorPuliyalil, H.
dc.contributor.imecauthorVersluijs, J.
dc.contributor.imecauthorLesniewska, A.
dc.contributor.imecauthorVarela-Pereira, O.
dc.contributor.imecauthorBaert, R.
dc.contributor.imecauthorPaolillo, S.
dc.contributor.imecauthorDecoster, S.
dc.contributor.imecauthorSchleicher, F.
dc.contributor.imecauthorMontero, D.
dc.contributor.imecauthorBekaert, J.
dc.contributor.imecauthorKesters, E.
dc.contributor.imecauthorLe, Q. T.
dc.contributor.imecauthorLorant, C.
dc.contributor.imecauthorTeugels, L.
dc.contributor.imecauthorHeylen, N.
dc.contributor.imecauthorJourdan, N.
dc.contributor.imecauthorEl-Mekki, Z.
dc.contributor.imecauthorvan der Veen, M.
dc.contributor.imecauthorCiofi, I
dc.contributor.imecauthorBriggs, B.
dc.contributor.imecauthorHeijlen, J.
dc.contributor.imecauthorDupas, L.
dc.contributor.imecauthorDe-Wachter, B.
dc.contributor.imecauthorVancoille, E.
dc.contributor.imecauthorWebers, T.
dc.contributor.imecauthorVats, H.
dc.contributor.imecauthorRynders, L.
dc.contributor.imecauthorCupak, M.
dc.contributor.imecauthorUk-Lee, J.
dc.contributor.imecauthorDrissi, Y.
dc.contributor.imecauthorHalipre, L.
dc.contributor.imecauthorCharley, A-L
dc.contributor.imecauthorVerdonck, P.
dc.contributor.imecauthorWitters, T.
dc.contributor.imecauthorGompel, S., V
dc.contributor.imecauthorKimura, Y.
dc.contributor.imecauthorDemonie, I
dc.contributor.imecauthorLazzarino, F.
dc.contributor.imecauthorErcken, M.
dc.contributor.imecauthorKim, R.
dc.contributor.imecauthorTrivkovic, D.
dc.contributor.imecauthorCroes, K.
dc.contributor.imecauthorLeray, P.
dc.contributor.imecauthorJaysankar, M.
dc.contributor.imecauthorWilson, C.
dc.contributor.imecauthorMuroch, G.
dc.contributor.imecauthorTokei, Z.
dc.identifier.doi10.1109/IEDM13553.2020.9372096
dc.identifier.eisbn978-1-7281-8888-1
dc.source.numberofpages4
dc.source.peerreviewyes
dc.source.conferenceIEEE International Electron Devices Meeting (IEDM)
dc.source.conferencedateDEC 12-18, 2020
imec.availabilityUnder review


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320.500.12860/38538.32021-12-16T14:17:12Zvalidation by library/open access desk
220.500.12860/38538.22021-12-16T13:55:53Zvalidation by library/open access desk
120.500.12860/38538*2021-12-06T02:06:16Z

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