| dc.contributor.author | Park, Kimoon | |
| dc.contributor.author | Inoue, Fumihiro | |
| dc.contributor.author | Derakhshandeh, Jaber | |
| dc.contributor.author | Yoo, Bongyoung | |
| dc.date.accessioned | 2022-08-26T10:27:12Z | |
| dc.date.available | 2022-03-30T02:07:17Z | |
| dc.date.available | 2022-06-09T14:13:30Z | |
| dc.date.available | 2022-08-26T10:27:12Z | |
| dc.date.issued | 2022 | |
| dc.identifier.issn | 0021-4922 | |
| dc.identifier.other | WOS:000770132000001 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/39550.4 | |
| dc.source | WOS | |
| dc.title | Electrochemical deposition of indium from chloride bath for low-temperature microbump bonding | |
| dc.type | Journal article | |
| dc.contributor.imecauthor | Park, Kimoon | |
| dc.contributor.imecauthor | Inoue, Fumihiro | |
| dc.contributor.imecauthor | Derakhshandeh, Jaber | |
| dc.contributor.orcidimec | Derakhshandeh, Jaber::0000-0003-2448-9165 | |
| dc.identifier.doi | 10.35848/1347-4065/ac52ba | |
| dc.source.numberofpages | 9 | |
| dc.source.peerreview | yes | |
| dc.source.beginpage | 041003 | |
| dc.source.journal | JAPANESE JOURNAL OF APPLIED PHYSICS | |
| dc.source.issue | 4 | |
| dc.source.volume | 61 | |
| imec.availability | Published - open access | |
| dc.description.wosFundingText | This research was supported by the MOTIE (Ministry of Trade, Industry, and Energy) in Korea, under the Fostering Global Talents for Innovative Growth Program (P0008745) supervised by the Korea Institute for Advancement of Technology (KIAT). | |
