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dc.contributor.authorShohjoh, T.
dc.contributor.authorIkota, M.
dc.contributor.authorIsawa, M.
dc.contributor.authorLorusso, G. F.
dc.contributor.authorHoriguchi, N.
dc.contributor.authorBriggs, B.
dc.contributor.authorMertens, H.
dc.contributor.authorBogdanowicz, J.
dc.contributor.authorDe Bisschop, P.
dc.contributor.authorCharley, A-L
dc.date.accessioned2022-07-09T02:28:03Z
dc.date.available2022-07-09T02:28:03Z
dc.date.issued2021
dc.identifier.issn2380-9248
dc.identifier.otherWOS:000812325400209
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40097
dc.sourceWOS
dc.titleInspection and metrology challenges for 3 nm node devices and beyond
dc.typeProceedings paper
dc.contributor.imecauthorLorusso, G. F.
dc.contributor.imecauthorHoriguchi, N.
dc.contributor.imecauthorBriggs, B.
dc.contributor.imecauthorMertens, H.
dc.contributor.imecauthorBogdanowicz, J.
dc.contributor.imecauthorDe Bisschop, P.
dc.contributor.imecauthorCharley, A-L
dc.identifier.doi10.1109/IEDM19574.2021.9720711
dc.identifier.eisbn978-1-6654-2572-8
dc.source.numberofpages4
dc.source.peerreviewyes
dc.source.conferenceIEEE International Electron Devices Meeting (IEDM)
dc.source.conferencedateDEC 11-16, 2021
dc.source.conferencelocationSan Francisco
imec.availabilityUnder review


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