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dc.contributor.authorPantano, Nicolas
dc.contributor.authorChery, Emmanuel
dc.contributor.authorOp de Beeck, Maaike
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorBeyne, Eric
dc.date.accessioned2023-01-05T12:36:28Z
dc.date.available2022-09-17T02:52:06Z
dc.date.available2023-01-05T12:36:28Z
dc.date.issued2022
dc.identifier.issn0569-5503
dc.identifier.otherWOS:000848765300188
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40439.2
dc.sourceWOS
dc.titleBroadband Characterization of Polymers under Reliability Stresses and Impact of Capping Layer
dc.typeProceedings paper
dc.contributor.imecauthorPantano, Nicolas
dc.contributor.imecauthorChery, Emmanuel
dc.contributor.imecauthorOp de Beeck, Maaike
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecChery, Emmanuel::0000-0002-2526-3873
dc.contributor.orcidimecOp de Beeck, Maaike::0000-0002-2700-6432
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.identifier.doi10.1109/ECTC51906.2022.00195
dc.identifier.eisbn978-1-6654-7943-1
dc.source.numberofpages6
dc.source.peerreviewyes
dc.source.beginpage1218
dc.source.endpage1223
dc.source.conference72nd IEEE Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateMAY 31-JUN 01, 2022
dc.source.conferencelocationSan Diego
dc.source.journalna
imec.availabilityPublished - imec


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