Fundamental study of IMC grains at low anneal temperature

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dc.contributor.author	Gerets, Carine
dc.contributor.author	Derakhshandeh, Jaber
dc.contributor.author	Shafahian, Ehsan
dc.contributor.author	Cochet, Tom
dc.contributor.author	La Tulipe, Douglas Charles
dc.contributor.author	Beyer, Gerald
dc.contributor.author	Miller, Andy
dc.contributor.author	Beyne, Eric
dc.date.accessioned	2022-09-22T02:50:27Z
dc.date.available	2022-09-22T02:50:27Z
dc.date.issued	2022
dc.identifier.other	WOS:000851392600067
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/40472
dc.source	WOS
dc.title	Fundamental study of IMC grains at low anneal temperature
dc.type	Proceedings paper
dc.contributor.imecauthor	Gerets, Carine
dc.contributor.imecauthor	Derakhshandeh, Jaber
dc.contributor.imecauthor	Shafahian, Ehsan
dc.contributor.imecauthor	Cochet, Tom
dc.contributor.imecauthor	La Tulipe, Douglas Charles
dc.contributor.imecauthor	Beyer, Gerald
dc.contributor.imecauthor	Miller, Andy
dc.contributor.imecauthor	Beyne, Eric
dc.contributor.orcidimec	Derakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimec	Shafahian, Ehsan::0000-0001-6125-5793
dc.contributor.orcidimec	Miller, Andy::0000-0001-7048-2242
dc.contributor.orcidimec	Beyne, Eric::0000-0002-3096-050X
dc.identifier.eisbn	978-4-9911911-3-8
dc.source.numberofpages	2
dc.source.peerreview	yes
dc.source.beginpage	133
dc.source.endpage	134
dc.source.conference	International Conference on Electronics Packaging (ICEP)
dc.source.conferencedate	MAY 11-14, 2022
dc.source.conferencelocation	Sapporo
imec.availability	Under review

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Version	Item	Date	Summary
3	20.500.12860/40472.3	2023-06-20T07:55:03Z	validation by library/open access desk
1	20.500.12860/40472*	2022-09-22T02:50:27Z