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III-V on a Si platform for the next generations of communication systems

dc.contributor.authorParvais, B.
dc.contributor.authorVais, A.
dc.contributor.authorYadav, S.
dc.contributor.authorMols, Y.
dc.contributor.authorVermeersch, B.
dc.contributor.authorKodanarama, K. Vondkar
dc.contributor.authorBoccardi, G.
dc.contributor.authorKunert, B.
dc.contributor.authorCollaert, N.
dc.date.accessioned2022-09-22T02:50:30Z
dc.date.available2022-09-22T02:50:30Z
dc.date.issued2022
dc.identifier.otherWOS:000852566800084
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40479
dc.sourceWOS
dc.titleIII-V on a Si platform for the next generations of communication systems
dc.typeProceedings paper
dc.contributor.imecauthorParvais, B.
dc.contributor.imecauthorVais, A.
dc.contributor.imecauthorYadav, S.
dc.contributor.imecauthorMols, Y.
dc.contributor.imecauthorVermeersch, B.
dc.contributor.imecauthorKodanarama, K. Vondkar
dc.contributor.imecauthorBoccardi, G.
dc.contributor.imecauthorKunert, B.
dc.contributor.imecauthorCollaert, N.
dc.identifier.doi10.1109/EDTM53872.2022.9798159
dc.identifier.eisbn978-1-6654-2178-2
dc.source.numberofpages3
dc.source.peerreviewyes
dc.source.beginpage250
dc.source.endpage252
dc.source.conference6th IEEE Electron Devices Technology and Manufacturing Conference (EDTM)
dc.source.conferencedateMAR 06-09, 2022
imec.availabilityUnder review


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220.500.12860/40479.22022-11-15T10:19:40Zvalidation by library/open access desk
120.500.12860/40479*2022-09-22T02:50:30Z

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