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Low-Temperature Chemical Vapor Deposition of SiCN for Hybrid Bonding

dc.contributor.authorOnishi, Koki
dc.contributor.authorIwata, Tomoya
dc.contributor.authorHabuka, Hitoshi
dc.contributor.authorNagano, Fuya
dc.contributor.authorInoue, Fumihiro
dc.date.accessioned2022-09-22T02:50:45Z
dc.date.available2022-09-22T02:50:45Z
dc.date.issued2022
dc.identifier.otherWOS:000851392600030
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40482
dc.sourceWOS
dc.titleLow-Temperature Chemical Vapor Deposition of SiCN for Hybrid Bonding
dc.typeProceedings paper
dc.contributor.imecauthorNagano, Fuya
dc.contributor.orcidimecNagano, Fuya::0000-0001-5315-8694
dc.identifier.eisbn978-4-9911911-3-8
dc.source.numberofpages2
dc.source.peerreviewyes
dc.source.beginpage59
dc.source.endpage60
dc.source.conferenceInternational Conference on Electronics Packaging (ICEP)
dc.source.conferencedateMAY 11-14, 2022
dc.source.conferencelocationSapporo
imec.availabilityUnder review


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220.500.12860/40482.22022-12-19T10:01:58Zvalidation by library/open access desk
120.500.12860/40482*2022-09-22T02:50:45Z

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