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Low temperature source / drain epitaxy and functional silicides: essentials for ultimate contact scaling

dc.contributor.authorPorret, Clément
dc.contributor.authorEveraert, Jean-Luc
dc.contributor.authorSchaekers, Marc
dc.contributor.authorRagnarsson, Lars-Ake
dc.contributor.authorHikavyy, Andriy
dc.contributor.authorRosseel, Erik
dc.contributor.authorRengo, Gianluca
dc.contributor.authorLoo, Roger
dc.contributor.authorKhazaka, R.
dc.contributor.authorGivens, M.
dc.contributor.authorPiao, Xiaoyu
dc.contributor.authorMertens, Sofie
dc.contributor.authorHeylen, Nancy
dc.contributor.authorMertens, Hans
dc.contributor.authorToledo de Carvalho Cavalcante, Camila
dc.contributor.authorSterckx, Gunther
dc.contributor.authorBrus, Stephan
dc.contributor.authorNalin Mehta, Ankit
dc.contributor.authorKorytov, Maxim
dc.contributor.authorBatuk, Dmitry
dc.contributor.authorFavia, Paola
dc.contributor.authorLanger, Robert
dc.contributor.authorPourtois, Geoffrey
dc.contributor.authorSwerts, Johan
dc.contributor.authorDentoni Litta, Eugenio
dc.contributor.authorHoriguchi, Naoto
dc.date.accessioned2023-06-01T14:45:05Z
dc.date.available2023-05-25T20:20:01Z
dc.date.available2023-06-01T14:45:05Z
dc.date.issued2022
dc.identifier.issn2380-9248
dc.identifier.otherWOS:000968800700157
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/41621.2
dc.sourceWOS
dc.titleLow temperature source / drain epitaxy and functional silicides: essentials for ultimate contact scaling
dc.typeProceedings paper
dc.contributor.imecauthorPorret, Clément
dc.contributor.imecauthorEveraert, Jean-Luc
dc.contributor.imecauthorSchaekers, Marc
dc.contributor.imecauthorRagnarsson, Lars-Ake
dc.contributor.imecauthorHikavyy, Andriy
dc.contributor.imecauthorRosseel, Erik
dc.contributor.imecauthorRengo, Gianluca
dc.contributor.imecauthorLoo, Roger
dc.contributor.imecauthorPiao, Xiaoyu
dc.contributor.imecauthorMertens, Sofie
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorMertens, Hans
dc.contributor.imecauthorToledo de Carvalho Cavalcante, Camila
dc.contributor.imecauthorSterckx, Gunther
dc.contributor.imecauthorBrus, Stephan
dc.contributor.imecauthorNalin Mehta, Ankit
dc.contributor.imecauthorKorytov, Maxim
dc.contributor.imecauthorBatuk, Dmitry
dc.contributor.imecauthorFavia, Paola
dc.contributor.imecauthorLanger, Robert
dc.contributor.imecauthorPourtois, Geoffrey
dc.contributor.imecauthorSwerts, Johan
dc.contributor.imecauthorDentoni Litta, Eugenio
dc.contributor.imecauthorHoriguchi, Naoto
dc.contributor.orcidimecPorret, Clément::0000-0002-4561-348X
dc.contributor.orcidimecEveraert, Jean-Luc::0000-0002-0660-9090
dc.contributor.orcidimecSchaekers, Marc::0000-0002-1496-7816
dc.contributor.orcidimecRagnarsson, Lars-Ake::0000-0003-1057-8140
dc.contributor.orcidimecHikavyy, Andriy::0000-0002-8201-075X
dc.contributor.orcidimecLoo, Roger::0000-0003-3513-6058
dc.contributor.orcidimecMertens, Sofie::0000-0002-1482-6730
dc.contributor.orcidimecBrus, Stephan::0000-0003-3554-0640
dc.contributor.orcidimecNalin Mehta, Ankit::0000-0002-2169-940X
dc.contributor.orcidimecBatuk, Dmitry::0000-0002-6384-6690
dc.contributor.orcidimecFavia, Paola::0000-0002-1019-3497
dc.contributor.orcidimecLanger, Robert::0000-0002-1132-3468
dc.contributor.orcidimecPourtois, Geoffrey::0000-0003-2597-8534
dc.contributor.orcidimecDentoni Litta, Eugenio::0000-0003-0333-376X
dc.contributor.orcidimecHoriguchi, Naoto::0000-0001-5490-0416
dc.contributor.orcidimecRengo, Gianluca::0000-0002-3410-6466
dc.contributor.orcidimecPiao, Xiaoyu::0000-0002-2204-9636
dc.contributor.orcidimecHeylen, Nancy::0009-0008-0490-0993
dc.contributor.orcidimecMertens, Hans::0000-0002-3392-6892
dc.contributor.orcidimecToledo de Carvalho Cavalcante, Camila::0009-0009-8055-5703
dc.contributor.orcidimecKorytov, Maxim::0009-0001-9313-7019
dc.contributor.orcidimecSwerts, Johan::0000-0001-7547-7194
dc.identifier.doi10.1109/IEDM45625.2022.10019501
dc.identifier.eisbn978-1-6654-8959-1
dc.source.numberofpages4
dc.source.peerreviewyes
dc.source.conferenceInternational Electron Devices Meeting (IEDM)
dc.source.conferencedateDEC 03-07, 2022
dc.source.conferencelocationSan Francisco
dc.source.journalna
imec.availabilityPublished - imec
dc.description.wosFundingTextThe imec core program members, the European Commission, local authorities, the imec pilot line, the imec material characterization and analysis group, ASM and Air Liquide Advanced Materials are acknowledged for their support. This project received funding from the ECSEL Joint Undertaking (JU) under grant agreement No 875999. The JU receives support from the European Union's Horizon 2020 research and innovation programme and Netherlands, Belgium, Germany, France, Austria, Hungary, United Kingdom, Romania, Israel.


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220.500.12860/41621.2*2023-06-01T14:37:09Zvalidation by library/open access desk
120.500.12860/416212023-05-25T20:20:01Z

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