Reduced resistivity of NiAl by backthinning for advanced interconnect metallization

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dc.contributor.author	Soulie, Jean-Philippe
dc.contributor.author	Tokei, Zsolt
dc.contributor.author	Heylen, Nancy
dc.contributor.author	Adehnann, Christoph
dc.date.accessioned	2023-08-07T17:07:24Z
dc.date.available	2023-08-07T17:07:24Z
dc.date.issued	2023
dc.identifier.issn	2380-632X
dc.identifier.other	WOS:001027381700053
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/42288
dc.source	WOS
dc.title	Reduced resistivity of NiAl by backthinning for advanced interconnect metallization
dc.type	Proceedings paper
dc.contributor.imecauthor	Soulie, Jean-Philippe
dc.contributor.imecauthor	Tokei, Zsolt
dc.contributor.imecauthor	Heylen, Nancy
dc.contributor.imecauthor	Adehnann, Christoph
dc.contributor.orcidimec	Soulie, Jean-Philippe::0000-0002-5956-6485
dc.identifier.doi	10.1109/IITC/MAM57687.2023.10154878
dc.identifier.eisbn	979-8-3503-1097-9
dc.source.numberofpages	3
dc.source.peerreview	yes
dc.source.conference	IEEE International Interconnect Technology Conference (IITC) / IEEE Materials for Advanced Metallization Conference (MAM)
dc.source.conferencedate	MAY 22-25, 2023
dc.source.conferencelocation	Dresden
imec.availability	Under review

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Version	Item	Date	Summary
2	20.500.12860/42288.2	2023-08-11T12:51:38Z	validation by library/open access desk
1	20.500.12860/42288*	2023-08-07T17:07:24Z