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Low temperature SiCN as dielectric for hybrid bonding

dc.contributor.authorChannam, Venkat Sunil Kumar
dc.contributor.authorIacovo, Serena
dc.contributor.authorWalsby, Edward
dc.contributor.authorBelov, Igor
dc.contributor.authorJourdain, Anne
dc.contributor.authorSepulveda, Alfonso
dc.contributor.authorBeyne, Eric
dc.date.accessioned2023-09-03T17:38:49Z
dc.date.available2023-09-03T17:38:49Z
dc.date.issued2023
dc.identifier.otherWOS:001004185500104
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42453
dc.sourceWOS
dc.titleLow temperature SiCN as dielectric for hybrid bonding
dc.typeProceedings paper
dc.contributor.imecauthorChannam, Venkat Sunil Kumar
dc.contributor.imecauthorIacovo, Serena
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorSepulveda, Alfonso
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecChannam, Venkat Sunil Kumar::0000-0003-2034-4313
dc.contributor.orcidimecIacovo, Serena::0000-0002-0826-9165
dc.contributor.orcidimecJourdain, Anne::0000-0002-7610-0513
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.identifier.doi10.1109/EDTM55494.2023.10103036
dc.identifier.eisbn979-8-3503-3252-0
dc.source.numberofpages3
dc.source.peerreviewyes
dc.source.conference7th IEEE Electron Devices Technology and Manufacturing Conference (EDTM)
dc.source.conferencedateMAR 07-10, 2023
dc.source.conferencelocationSeoul
imec.availabilityUnder review


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320.500.12860/42453.32024-03-25T15:35:03Zvalidation by library/open access desk
220.500.12860/42453.22023-09-07T09:48:12Zvalidation by imec author
120.500.12860/42453*2023-09-03T17:38:49Z

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