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Reliability Investigations of Polymer Based Redistribution Layers (RDL) Protected by a Mold Layer

dc.contributor.authorKwak, Ji-Youn
dc.contributor.authorChery, Emmanuel
dc.contributor.authorBertheau, Julien
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorBeyne, Eric
dc.date.accessioned2024-06-04T09:26:45Z
dc.date.available2023-10-23T17:27:42Z
dc.date.available2024-06-04T09:26:45Z
dc.date.issued2023
dc.identifier.issn0569-5503
dc.identifier.otherWOS:001047624100176
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42918.2
dc.sourceWOS
dc.titleReliability Investigations of Polymer Based Redistribution Layers (RDL) Protected by a Mold Layer
dc.typeProceedings paper
dc.contributor.imecauthorChery, Emmanuel
dc.contributor.imecauthorBertheau, Julien
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecChery, Emmanuel::0000-0002-2526-3873
dc.contributor.orcidimecSlabbekoorn, John::0000-0002-6098-8618
dc.contributor.orcidimecDe Messemaeker, Joke::0000-0002-4872-0176
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.identifier.doi10.1109/ECTC51909.2023.00184
dc.identifier.eisbn979-8-3503-3498-2
dc.source.numberofpages5
dc.source.peerreviewyes
dc.source.beginpage1080
dc.source.endpage1084
dc.source.conferenceIEEE 73rd Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateMAY 30-JUN 02, 2023
dc.source.conferencelocationOrlando
dc.source.journalN/A
imec.availabilityPublished - imec
dc.description.wosFundingTextThe authors would like to express their gratitude to the different imec teams involved in this study. Contributions from imec's 3D IIAP program are deeply acknowledged. Special thanks for the numerous FIB cross-section requests handled by Dr. Olivier Richard and Ms. Chris Drijbooms. Part of this research was supported by the MOTIE (Ministry of Trade, Industry, and Energy) in Korea, under the Fostering Global Talents for Innovative Growth Program (P0017312) supervised by the Korea Institute for Advancement of Technology (KIAT).


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220.500.12860/42918.2*2024-06-04T09:25:46Zvalidation by library/open access desk
120.500.12860/429182023-10-23T17:27:42Z

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