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Process challenges during CVD oxide deposition on the backside of 20-μm thin 300-mm wafers temporarily bonded to glass carriers.

dc.contributor.authorKennes, Koen
dc.contributor.authorGuerrero, Alice
dc.contributor.authorSalahouelhadj, Abdellah
dc.contributor.authorSuhard, Samuel
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorBrems, Steven
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2023-12-18T11:49:55Z
dc.date.available2023-10-24T17:34:32Z
dc.date.available2023-12-18T11:49:55Z
dc.date.issued2023
dc.identifier.issn0569-5503
dc.identifier.otherWOS:001047624100259
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42946.2
dc.sourceWOS
dc.titleProcess challenges during CVD oxide deposition on the backside of 20-μm thin 300-mm wafers temporarily bonded to glass carriers.
dc.typeProceedings paper
dc.contributor.imecauthorKennes, Koen
dc.contributor.imecauthorSalahouelhadj, Abdellah
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorBrems, Steven
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecKennes, Koen::0000-0002-5987-2167
dc.contributor.orcidimecSalahouelhadj, Abdellah::0000-0002-3795-1446
dc.contributor.orcidimecSuhard, Samuel::0000-0002-6650-5947
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecPhommahaxay, Alain::0000-0001-8672-2386
dc.contributor.orcidimecBrems, Steven::0000-0002-0282-8528
dc.contributor.orcidimecBeyer, Gerald::0009-0001-0376-866X
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.identifier.doi10.1109/ECTC51909.2023.00269
dc.identifier.eisbn979-8-3503-3498-2
dc.source.numberofpages6
dc.source.peerreviewyes
dc.source.beginpage1584
dc.source.endpage1589
dc.source.conferenceIEEE 73rd Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateMAY 30-JUN 02, 2023
dc.source.conferencelocationOrlando
dc.source.journalna
imec.availabilityPublished - imec


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220.500.12860/42946.2*2023-12-18T11:48:21Zvalidation by library/open access desk
120.500.12860/429462023-10-24T17:34:32Z

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