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EUV mask defect inspection for the 3nm technology node

dc.contributor.authorHermans, Yannick
dc.contributor.authorHeil, Tilmann
dc.contributor.authorCapelli, Renzo
dc.contributor.authorSzafranek, Bartholomaeus
dc.contributor.authorRhinow, Daniel
dc.contributor.authorMette, Gerson
dc.contributor.authorSalg, Patrick
dc.contributor.authorHermanns, Chistian Felix
dc.contributor.authorDey, Bappaditya
dc.contributor.authorHalipre, Luc
dc.contributor.authorTrivkovic, Darko
dc.contributor.authorRincon Delgadillo, Paulina
dc.contributor.authorMarschner, Thomas
dc.contributor.authorHalder, Sandip
dc.date.accessioned2024-08-05T13:26:38Z
dc.date.available2023-10-30T08:30:50Z
dc.date.available2024-08-05T13:26:38Z
dc.date.issued2023
dc.identifier.issn0277-786X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/43033.2
dc.titleEUV mask defect inspection for the 3nm technology node
dc.typeProceedings paper
dc.contributor.imecauthorHermans, Yannick
dc.contributor.imecauthorDey, Bappaditya
dc.contributor.imecauthorHalipre, Luc
dc.contributor.imecauthorTrivkovic, Darko
dc.contributor.imecauthorRincon Delgadillo, Paulina
dc.contributor.imecauthorHalder, Sandip
dc.contributor.orcidimecHermans, Yannick::0000-0002-6973-0795
dc.contributor.orcidimecDey, Bappaditya::0000-0002-0886-137X
dc.contributor.orcidimecHalipre, Luc::0009-0001-5469-6686
dc.contributor.orcidimecTrivkovic, Darko::0009-0003-7858-1802
dc.contributor.orcidimecHalder, Sandip::0000-0002-6314-2685
dc.date.embargo2023-10-05
dc.source.numberofpages10
dc.source.peerreviewno
dc.source.beginpageArt. 128020H
dc.source.conference38th European Mask and Lithography Conference (EMLC 2023)
dc.source.conferencedate17/06/2023
dc.source.conferencelocationDresden
dc.source.journalProceedings of SPIE
imec.availabilityPublished - open access


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220.500.12860/43033.2*2024-08-05T13:24:18Zvalidation by library/open access desk
120.500.12860/430332023-10-30T08:30:50Z

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