Show simple item record

dc.contributor.authorCeliker, Hikmet
dc.contributor.authorDehaene, Wim
dc.contributor.authorMyny, Kris
dc.date.accessioned2024-10-09T09:13:03Z
dc.date.available2024-08-04T17:39:26Z
dc.date.available2024-10-09T09:13:03Z
dc.date.issued2024
dc.identifier.issn0028-0836
dc.identifier.otherWOS:001207800900007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44267.2
dc.sourceWOS
dc.titleMulti-project wafers for flexible thin-film electronics by independent foundries
dc.typeJournal article
dc.contributor.imecauthorCeliker, Hikmet
dc.contributor.imecauthorDehaene, Wim
dc.contributor.imecauthorMyny, Kris
dc.contributor.orcidimecCeliker, Hikmet::0000-0001-8429-0153
dc.contributor.orcidimecDehaene, Wim::0000-0002-6792-7965
dc.contributor.orcidimecMyny, Kris::0000-0002-5230-495X
dc.date.embargo2024-04-24
dc.identifier.doi10.1038/s41586-024-07306-2
dc.source.numberofpages7
dc.source.peerreviewyes
dc.source.beginpage335
dc.source.endpage340
dc.source.journalNATURE
dc.identifier.pmidMEDLINE:38658759
dc.source.issue8011
dc.source.volume629
imec.availabilityPublished - open access
dc.description.wosFundingTextWe thank PanelSemi (a system-on-film foundry service provider in Taiwan) for providing LTPS panels and Pragmatic for providing IGZO wafers as a verification of our designs, using their foundry-mode panel and wafer delivery services. Part of this work has received funding under the Horizon Europe programme from the European Research Council under grant agreement no. 101088591 'ORISON project'. Views and opinions expressed are, however, those of the authors only and do not necessarily reflect those of the European Union or the European Research Council. Neither the European Union nor the granting authority can be held responsible for them.


Files in this item

Thumbnail

This item appears in the following collection(s)

Show simple item record

VersionItemDateSummary

*Selected version