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Special Section Guest Editorial: Packaging Challenges of Photonic Integrated Circuits

dc.contributor.authorMissinne, Jeroen
dc.contributor.authorLi, Yanlu
dc.contributor.authorMohrdiek, Stefan
dc.contributor.authorMorrissey, Padraic
dc.date.accessioned2025-04-10T13:21:53Z
dc.date.available2024-09-14T17:21:08Z
dc.date.available2025-04-10T13:21:53Z
dc.date.issued2024
dc.identifier.issn1932-5150
dc.identifier.otherWOS:001283921400006
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44484.2
dc.sourceWOS
dc.titleSpecial Section Guest Editorial: Packaging Challenges of Photonic Integrated Circuits
dc.typeEditorial material
dc.contributor.imecauthorMissinne, Jeroen
dc.contributor.imecauthorLi, Yanlu
dc.contributor.orcidimecMissinne, Jeroen::0000-0002-3470-620X
dc.contributor.orcidimecLi, YanLu::0000-0003-3440-1972
dc.date.embargo2024-01-27
dc.identifier.doi10.1117/1.JOM.4.1.011001
dc.source.numberofpages2
dc.source.peerreviewyes
dc.source.beginpageArt. 011001
dc.source.endpageN/A
dc.source.journalJOURNAL OF OPTICAL MICROSYSTEMS
dc.source.issue1
dc.source.volume4
imec.availabilityPublished - open access


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220.500.12860/44484.2*2025-04-10T13:18:53Zvalidation by library/open access desk
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