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Reliability Investigations of Advanced Photosensitive Polymer based RDL Processes Protected by Inorganic Capping Layers

dc.contributor.authorChery, Emmanuel
dc.contributor.authorBhatia, Ritwik
dc.contributor.authorSundaram, Ganesh
dc.contributor.authorPinho, Nelson
dc.contributor.authorBeyne, Eric
dc.date.accessioned2025-04-10T15:07:30Z
dc.date.available2024-12-07T16:57:01Z
dc.date.available2025-04-10T15:07:30Z
dc.date.issued2024
dc.identifier.isbn979-8-3503-7599-2
dc.identifier.issn0569-5503
dc.identifier.otherWOS:001260983500104
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44932.2
dc.sourceWOS
dc.titleReliability Investigations of Advanced Photosensitive Polymer based RDL Processes Protected by Inorganic Capping Layers
dc.typeProceedings paper
dc.contributor.imecauthorChery, Emmanuel
dc.contributor.imecauthorPinho, Nelson
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecChery, Emmanuel::0000-0002-2526-3873
dc.contributor.orcidimecPinho, Nelson::0000-0002-0701-5921
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.identifier.doi10.1109/ECTC51529.2024.00109
dc.identifier.eisbn979-8-3503-7598-5
dc.source.numberofpages7
dc.source.peerreviewyes
dc.source.beginpage647
dc.source.endpage653
dc.source.conferenceIEEE 74th Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateMAY 28-31, 2024
dc.source.conferencelocationDenver
dc.source.journalN/A
imec.availabilityPublished - imec


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220.500.12860/44932.2*2025-04-10T15:06:34Zvalidation by library/open access desk
120.500.12860/449322024-12-07T16:57:01Z

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