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A comparative study of copper drift diffusion in plasma deposited A-Sic:H and silicon nitride

dc.contributor.authorLanckmans, Filip
dc.contributor.authorGray, William
dc.contributor.authorBrijs, Bert
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-14T13:13:48Z
dc.date.available2021-10-14T13:13:48Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4513
dc.sourceIIOimport
dc.titleA comparative study of copper drift diffusion in plasma deposited A-Sic:H and silicon nitride
dc.typeOral presentation
dc.contributor.imecauthorMaex, Karen
dc.source.peerreviewno
dc.source.conferenceMaterials for Advanced Metallization Conference - MAM; February 28 - March 1, 2000; Stresa, Italy.
dc.source.conferencelocation
imec.availabilityPublished - imec


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