Authors

Lanckmans, Filip; Brongersma, Sywert; Poortmans, Jef; Conard, Thierry; Bender, Hugo; Beyne, Eric; Maex, Karen

Conference

MRS Spring Meeting. Symposium L: Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics; April

Title

Adhesion study between materials for integration of copper and inorganic low-k dielectrics

Publication type

Oral presentation

Embargo date

9999-12-31