Recently added

Nanopores equipped with optical antennas for single molecule raman spectroscopy

Chen, Chang; Kox, Ronald; Van Dorpe, Pol; Bertin, Pascal; Lagae, Liesbet; Maes, Guido; Borghs, Gustaaf (2008)

Integration issues in step and repeat UV nanoimprint lithography

Charpin-Nicolle, C.; Chiaroni, J.; Le Cunff, Y.; Denis, H.; Rochat, N.; Villani, M. L.; Massin, J.; Irmscher, M.; Vratzov, B.; van Hossen, H.; Gubbini, P.; Lorusso, Gian; Van Den Heuvel, Dieter (2008)

Magnetic tuning of surface acoustic wave devices within high frequency range

Cavaco, Celso; Francis, Laurent; Van Roy, Wim; Lagae, Liesbet; Borghs, Gustaaf (2008)

Magnetic tuning of surface acoustic wave devices within high frequency range

Cavaco, Celso; Francis, Laurent; Van Roy, Wim; Lagae, Liesbet; Borghs, Gustaaf (2008)

Thin-film technologies for mm-wave passives and antenna-interface realization

Carchon, Geert; Posada Quijano, Guillermo; Brebels, Steven; Vasylchenko, Alexander; De Raedt, Walter (2008)

MtM RF technologies

Carchon, Geert; De Raedt, Walter; Tilmans, Harrie; Beyne, Eric (2008)

RF packaging activities @ imec

Carchon, Geert; De Raedt, Walter; Soussan, Philippe; Tilmans, Harrie; Beyne, Eric (2008)

3D SiP for miniature RF modules

Carchon, Geert (2008)

Doorbraak in plastic RFID labels

Bruynseraede, Christophe; Myny, Kris (2008)

RF functional blocks for 3D integration of a beamsteering antenna

Brebels, Steven; Nicole, Pierre; Li, Xia; Fernández-Bolaños, Montserrat (2008)

Challenges of etching new gate materials for Si device below 45nm node

Boullart, Werner (2008)

Process development for passive photonic circuits on BCB- bonded InP membranes on silicon

Bordas, F.; Van Laere, Frederik; Geluk, E.; Karouta, F.; Van Thourhout, Dries; Baets, Roel; Smit, M. (2008)

Surface engineering: A way to bridge technology and biology

Bonroy, Kristien; Jans, Karolien; Van de Broek, Bieke; Jans, Hilde; Trekker, Jesse; Peeters, Sara; Reekmans, Gunter; Bartic, Carmen; Stakenborg, Tim (2008)

Evaluation of a new dielectric surface treatment for organic CMOS technology

Bode, Dieter; Schols, Sarah; Rolin, Cedric; Debucquoy, Maarten; Gelinck, Gerwin; Genoe, Jan; Heremans, Paul (2008)

Design for organic CMOS

Bode, Dieter (2008)

Integration of dual work function CMOS using doped high-K dielectric and metal gates to achieve improved power-performance

Biesemans, Serge (2008)

Presentations: Recent submissions

Nanopores equipped with optical antennas for single molecule raman spectroscopy

Integration issues in step and repeat UV nanoimprint lithography

Magnetic tuning of surface acoustic wave devices within high frequency range

Magnetic tuning of surface acoustic wave devices within high frequency range

Thin-film technologies for mm-wave passives and antenna-interface realization

MtM RF technologies

RF packaging activities @ imec

3D SiP for miniature RF modules

Doorbraak in plastic RFID labels

RF functional blocks for 3D integration of a beamsteering antenna

Challenges of etching new gate materials for Si device below 45nm node

Process development for passive photonic circuits on BCB- bonded InP membranes on silicon

Surface engineering: A way to bridge technology and biology

Evaluation of a new dielectric surface treatment for organic CMOS technology

Design for organic CMOS

Integration of dual work function CMOS using doped high-K dielectric and metal gates to achieve improved power-performance

MEMS packaging using 3D-Si integration approaches

3D packaging technologies

TSV technology overview

3D integration

Presentations: Recent submissions

Nanopores equipped with optical antennas for single molecule raman spectroscopy ﻿

Integration issues in step and repeat UV nanoimprint lithography ﻿

Magnetic tuning of surface acoustic wave devices within high frequency range ﻿

Magnetic tuning of surface acoustic wave devices within high frequency range ﻿

Thin-film technologies for mm-wave passives and antenna-interface realization ﻿

MtM RF technologies ﻿

RF packaging activities @ imec ﻿

3D SiP for miniature RF modules ﻿

Doorbraak in plastic RFID labels ﻿

RF functional blocks for 3D integration of a beamsteering antenna ﻿

Challenges of etching new gate materials for Si device below 45nm node ﻿

Process development for passive photonic circuits on BCB- bonded InP membranes on silicon ﻿

Surface engineering: A way to bridge technology and biology ﻿

Evaluation of a new dielectric surface treatment for organic CMOS technology ﻿

Design for organic CMOS ﻿

Integration of dual work function CMOS using doped high-K dielectric and metal gates to achieve improved power-performance ﻿

MEMS packaging using 3D-Si integration approaches ﻿

3D packaging technologies ﻿

TSV technology overview ﻿

3D integration ﻿

Nanopores equipped with optical antennas for single molecule raman spectroscopy

Integration issues in step and repeat UV nanoimprint lithography

Magnetic tuning of surface acoustic wave devices within high frequency range

Magnetic tuning of surface acoustic wave devices within high frequency range

Thin-film technologies for mm-wave passives and antenna-interface realization

MtM RF technologies

RF packaging activities @ imec

3D SiP for miniature RF modules

Doorbraak in plastic RFID labels

RF functional blocks for 3D integration of a beamsteering antenna

Challenges of etching new gate materials for Si device below 45nm node

Process development for passive photonic circuits on BCB- bonded InP membranes on silicon

Surface engineering: A way to bridge technology and biology

Evaluation of a new dielectric surface treatment for organic CMOS technology

Design for organic CMOS

Integration of dual work function CMOS using doped high-K dielectric and metal gates to achieve improved power-performance

MEMS packaging using 3D-Si integration approaches

3D packaging technologies

TSV technology overview

3D integration