Recently added

Integrated passives and filters using MCM-D technology

Carchon, Geert; De Raedt, Walter; Beyne, Eric (2005)

On-chip and in-package thin-film passive component integration

Carchon, Geert (2005)

Effect of varying the initial conditions prior to flash-assist rapid thermal processing on dopant activation, diffusion, and defect populations

Camillo-Castillo, Renata; Law, M.E.; Lindsay, Richard; Maex, Karen; Pawlak, Bartek; McCoy, S. (2005)

An offline bidirectional tracking scheme

Caljon, T.; Enescu, V.; Schelkens, Peter; Sahli, Hichem (2005)

Continued scalability of copper/low-k interconnects

Brongersma, Sywert; Carbonell, Laure; Vanstreels, Kris; Iacopi, Francesca; D'Haen, Jan; Zhang, Wenqi; Travaly, Youssef; Demuynck, Steven; Tokei, Zsolt; De Ceuninck, Ward; Maex, Karen (2005)

Metallization for future interconnects

Brongersma, Sywert (2005)

Electrodeposition for copper metallization

Brongersma, Sywert (2005)

Stress issues in copper/low-k integration

Brongersma, Sywert (2005)

Copper resistivity

Brongersma, Sywert (2005)

The analysis of a thin SiO2/SixN1-x/SiO2 stack, a comparative study of low energy ERD with XPS, low energy SIMS, HRBS, HR-ERD

Brijs, Bert; Giangrandi, Simone; Arstila, K.; Bergmaier, A.; Kimura, K.; Conard, Thierry; Vandervorst, Wilfried; Vantomme, Andre (2005)

Formal methods as a unifying basis for electrical and computer engineering

Boute, Raymond (2005)

Multi-antenna techniques for broadband wireless communications

Bourdoux, André (2005)

Bias-dependent spin relaxation in spin-LED

Bosco, C.A.C.; Snouck, D.; Van Dorpe, Pol; Van Roy, Wim; Koopmans, B. (2005)

Quality of experience for personal multimedia communication devices

Bormans, Jan (2005)

Growth kinetics and relaxation mechanism of very thin epitaxial Si films on (100) germanium

Bonzom, Renaud; Leys, Frederik; Loo, Roger; Richard, Olivier; Vanhaeren, Danielle; Rip, Jens; Van Steenbergen, Jan; De Jaeger, Brice; Bender, Hugo; Vandervorst, Wilfried; Caymax, Matty; Meuris, Marc (2005)

Growth kinetics of germanium on (100) germanium by pyrolysis of germane

Bonzom, Renaud; Leys, Frederik; Loo, Roger; Dessein, Kristof; Vandervorst, Wilfried; Caymax, Matty (2005)

Epitaxial growth on germanium: kinetics and layer quality

Bonzom, Renaud; Leys, Frederik; Loo, Roger; Caymax, Matty; Vandervorst, Wilfried (2005)

Thin epitaxial Si film growth at low temperatures for germanium processing applications

Bonzom, Renaud; Leys, Frederik; Hellin, David; Loo, Roger; Caymax, Matty; Vandervorst, Wilfried (2005)

Realization and characterization of 3D gold substrates for biosensor applications

Bonroy, Kristien; Friedt, J.-M.; Frederix, Filip; De Palma, Randy; Janssen, Dimitri; Goddeeris, B.; Borghs, Gustaaf (2005)

Increasing immunosensor responses: from antibody fragments and 3D substrates to functionalized nanoparticles

Bonroy, Kristien; Frederix, Filip; Cliquet, P.; Reekmans, Gunter; Jans, Hilde; Ghoos, Toon; De Palma, Randy; Laureyn, Wim; Goddeeris, B.; Declerck, P.; Borghs, Gustaaf (2005)

Presentations: Recent submissions

Integrated passives and filters using MCM-D technology ﻿

On-chip and in-package thin-film passive component integration ﻿

Effect of varying the initial conditions prior to flash-assist rapid thermal processing on dopant activation, diffusion, and defect populations ﻿

An offline bidirectional tracking scheme ﻿

Continued scalability of copper/low-k interconnects ﻿

Metallization for future interconnects ﻿

Electrodeposition for copper metallization ﻿

Stress issues in copper/low-k integration ﻿

Copper resistivity ﻿

The analysis of a thin SiO2/SixN1-x/SiO2 stack, a comparative study of low energy ERD with XPS, low energy SIMS, HRBS, HR-ERD ﻿

Formal methods as a unifying basis for electrical and computer engineering ﻿

Multi-antenna techniques for broadband wireless communications ﻿

Bias-dependent spin relaxation in spin-LED ﻿

Quality of experience for personal multimedia communication devices ﻿

Growth kinetics and relaxation mechanism of very thin epitaxial Si films on (100) germanium ﻿

Growth kinetics of germanium on (100) germanium by pyrolysis of germane ﻿

Epitaxial growth on germanium: kinetics and layer quality ﻿

Thin epitaxial Si film growth at low temperatures for germanium processing applications ﻿

Realization and characterization of 3D gold substrates for biosensor applications ﻿

Increasing immunosensor responses: from antibody fragments and 3D substrates to functionalized nanoparticles ﻿

Integrated passives and filters using MCM-D technology

On-chip and in-package thin-film passive component integration

Effect of varying the initial conditions prior to flash-assist rapid thermal processing on dopant activation, diffusion, and defect populations

An offline bidirectional tracking scheme

Continued scalability of copper/low-k interconnects

Metallization for future interconnects

Electrodeposition for copper metallization

Stress issues in copper/low-k integration

Copper resistivity

The analysis of a thin SiO2/SixN1-x/SiO2 stack, a comparative study of low energy ERD with XPS, low energy SIMS, HRBS, HR-ERD

Formal methods as a unifying basis for electrical and computer engineering

Multi-antenna techniques for broadband wireless communications

Bias-dependent spin relaxation in spin-LED

Quality of experience for personal multimedia communication devices

Growth kinetics and relaxation mechanism of very thin epitaxial Si films on (100) germanium

Growth kinetics of germanium on (100) germanium by pyrolysis of germane

Epitaxial growth on germanium: kinetics and layer quality

Thin epitaxial Si film growth at low temperatures for germanium processing applications

Realization and characterization of 3D gold substrates for biosensor applications

Increasing immunosensor responses: from antibody fragments and 3D substrates to functionalized nanoparticles