Recently added

Wafer level packaging interconnect technology

Beyne, Eric (2003)

Multilayer thin film technology as an enabling technology for System-in-Package (SIP) and "above-IC" Processing

Beyne, Eric (2003)

Impact van de micro-elektronica evoluties op de chip interconnectie en verpakkingstechnologieën

Beyne, Eric (2003)

High resolution depth profiling of future gate dielectric materials

Bergmaier, A.; Dollinger, G.; Görgens, L.; Neumaier, P.; Bender, Hugo; Brijs, Bert; Conard, Thierry; Houssiau, L. (2003)

In-situ plucker system for preparation of TEM samples by FIB: new applications, future prospects and challenges

Benedetti, Alessandro; Bender, Hugo (2003)

Focused ion beam sample preparation: applications in materials science

Bender, Hugo; Benedetti, Alessandro; Richard, Olivier; Van Marcke, Patricia; Drijbooms, Chris (2003)

Developments in the structural characterisation of silicides

Bender, Hugo (2003)

Charge injection across a metal/disordered organic semiconductor interface

Bassler, H.; Arkhipov, Vladimir (2003)

Coding of motion vectors produced by wavelet-domain motion estimation

Barbarien, J.; Andreopoulos, I.; Munteanu, A.; Schelkens, P.; Cornelis, Jan (2003)

Accurate Extraction of Time Domain Performance through Windowless Transforms

Balachandran, Jayaprakash; Chandrasekhar, Arun; Beyne, Eric; De Raedt, Walter; Nauwelaers, Bart (2003)

Trends in MEMS/MST packaging and system integration

Baert, Kris; Beyne, Eric (2003)

Charge carrier mobility in doped disordered organic semiconductors

Arkhipov, Vladimir; Heremans, Paul; Emelianova, E.V.; Adriaenssens, G.J.; Bassler, H. (2003)

Response to call for evidence on scalable video coding

Andreopoulos, I.; Barbarien, J.; Verdicchio, F.; Munteanu, A.; van der Schaar, M.; Cornelis, Jan; Schelkens, P. (2003)

Current trends in silicon solar cells design and processing

Agostinelli, Guido; De Wolf, Stefaan; Dekkers, Harold; Duerinckx, Filip; Choulat, Patrick; Beaucarne, Guy (2003)

Dry processing for crystalline silicon solar cells

Agostinelli, Guido; De Wolf, Stefaan; Dekkers, Harold; Beaucarne, Guy; Le, Q.N.; Goldbach, H.D.; Schropp, R.E.I.; Pinter, I.; Walther, G.; Schade, K.; Vitanov, P.; Vukadinovic, M.; Topic, M. (2003)

The influence of the donor/acceptor ratio on the performance of organic bulkheterojunction solar cells

Aernouts, Tom; Vanlaeke, Peter; Geens, Wim; Poortmans, Jef; Heremans, Paul; Borghs, Gustaaf; Mertens, Robert (2003)

Plastic solar cells: screen-printing as a novel deposition technique

Aernouts, Tom; Vanlaeke, Peter; Poortmans, Jef; Heremans, Paul (2003)

Correlation between solvent diffusion, porosity and pore sealing for low k dielectrics

Abell, Thomas; Shamiryan, Denis; Patz, Matthias; Maex, Karen (2003)

Packaging, systeemintegratie en betrouwbaarheid

Baert, Kris (2004)

Generation of hole traps in oxides under high field stresses

Zhao, Chao; Zhang, J.F.; Groeseneken, Guido; Degraeve, Robin (2002)

Presentations: Recent submissions

Wafer level packaging interconnect technology ﻿

Multilayer thin film technology as an enabling technology for System-in-Package (SIP) and "above-IC" Processing ﻿

Impact van de micro-elektronica evoluties op de chip interconnectie en verpakkingstechnologieën ﻿

High resolution depth profiling of future gate dielectric materials ﻿

In-situ plucker system for preparation of TEM samples by FIB: new applications, future prospects and challenges ﻿

Focused ion beam sample preparation: applications in materials science ﻿

Developments in the structural characterisation of silicides ﻿

Charge injection across a metal/disordered organic semiconductor interface ﻿

Coding of motion vectors produced by wavelet-domain motion estimation ﻿

Accurate Extraction of Time Domain Performance through Windowless Transforms ﻿

Trends in MEMS/MST packaging and system integration ﻿

Charge carrier mobility in doped disordered organic semiconductors ﻿

Response to call for evidence on scalable video coding ﻿

Current trends in silicon solar cells design and processing ﻿

Dry processing for crystalline silicon solar cells ﻿

The influence of the donor/acceptor ratio on the performance of organic bulkheterojunction solar cells ﻿

Plastic solar cells: screen-printing as a novel deposition technique ﻿

Correlation between solvent diffusion, porosity and pore sealing for low k dielectrics ﻿

Packaging, systeemintegratie en betrouwbaarheid ﻿

Generation of hole traps in oxides under high field stresses ﻿

Wafer level packaging interconnect technology

Multilayer thin film technology as an enabling technology for System-in-Package (SIP) and "above-IC" Processing

Impact van de micro-elektronica evoluties op de chip interconnectie en verpakkingstechnologieën

High resolution depth profiling of future gate dielectric materials

In-situ plucker system for preparation of TEM samples by FIB: new applications, future prospects and challenges

Focused ion beam sample preparation: applications in materials science

Developments in the structural characterisation of silicides

Charge injection across a metal/disordered organic semiconductor interface

Coding of motion vectors produced by wavelet-domain motion estimation

Accurate Extraction of Time Domain Performance through Windowless Transforms

Trends in MEMS/MST packaging and system integration

Charge carrier mobility in doped disordered organic semiconductors

Response to call for evidence on scalable video coding

Current trends in silicon solar cells design and processing

Dry processing for crystalline silicon solar cells

The influence of the donor/acceptor ratio on the performance of organic bulkheterojunction solar cells

Plastic solar cells: screen-printing as a novel deposition technique

Correlation between solvent diffusion, porosity and pore sealing for low k dielectrics

Packaging, systeemintegratie en betrouwbaarheid

Generation of hole traps in oxides under high field stresses