Recently added

Defining the rationale for moving restoration and protection up to the MPLS layer

Van Heuven, Pim; Demeester, Piet (2000)

Design experiment for measurement and modeling of digital substrate noise generation

Van Heijningen, Marc; Compiet, John; Wambacq, P.; Donnay, Stephane (2000)

Analog addressed microdisplays

Van Calster, Andre (2000)

Development of generic technologies for the realisation of long wavelength photonic integrated circuits

Van Caenegem, Tom; Moerman, Ingrid (2000)

The use of convergent beam electron diffraction for stress measurements in shallow trench isolation structures

Stuer, Cindy; Van Landuyt, J.; Bender, Hugo; Rooyackers, Rita; Badenes, Gonçal; De Wolf, Ingrid (2000)

Material characteristics and damascene patterning of a fluoropolymer low-k film

Struyf, Herbert; Donaton, R. A.; Lepage, Muriel; Lanckmans, Filip; Vereecke, Guy; Maex, Karen; Vanhaelemeersch, Serge; Scheid, D. (2000)

Stress build-up during the Ni-silicidation in and around narrow silicide lines

Steegen, An; Lauwers, Anne; Chamirian, Oxana; Bender, Hugo; De Wolf, Ingrid; de Potter de ten Broeck, Muriel; De Tavernier, C.; Maex, Karen (2000)

Orientation dependent stress build-up during the formation of epitaxial CoSi2

Steegen, An; Detavernier, C.; Maex, Karen; Van Meirhaeghe, R. L.; Cardon, F. (2000)

Transfer of a thin porous silicon layer on foreign substrate

Solanki, Chetan Singh; Bilyalov, Renat; Poortmans, Jef (2000)

Defect analysis of n-type silicon strained layers

Simoen, Eddy; Loo, Roger; Roussel, Philippe; Caymax, Matty; Bender, Hugo; Claeys, C.; Herzog, H. J.; Blondeel, A.; Clauws, P. (2000)

Chemical mapping of V-defects in InGaN MQWs

Sharma, N.; Tricker, D. M.; Thomas, P. J.; Humphreys, C. J.; Bougrioua, Zahia; Jacobs, Koen; Cheyns, Jan; Moerman, Ingrid; Thrush, T.; Considine, L.; Boyd, A. (2000)

Effect of HF solution on the porous structure of low-k SICOH film

Shamiryan, Denis; Baklanov, Mikhaïl; Vanhaelemeersch, Serge; Maex, Karen (2000)

Effect of deposition and annealing temperature on the structural and mechanical properties of poly SiGe

Sedky, Sherif; Witvrouw, Ann; Caymax, Matty; Roussel, Philippe (2000)

Modeling of electromigration in interconnects

Schoenmaker, Wim (2000)

Properties of TiN thin films deposited by ALCVD as barriers for Cu metallization

Satta, Alessandra; Beyer, Gerald; Maex, Karen; Elers, K.; Haukka, S.; Vantomme, Andre (2000)

Reticle status and issues for application in advanced 193 nm lithography

Ronse, Kurt; Jonckheere, Rik; Vandenberghe, Geert (2000)

Advanced application of the field equivalence principle in boundary integral equation and hybrid formulations

Rogier, Hendrik; Wallyn, W.; De Zutter, Daniel; Olyslager, Frank (2000)

The work of the GOOD-DIE II network of excellence in Europe on the infrastructure for semiconductor technologies

Roggen, Jean; Roughton, M.; Radley, D. (2000)

Lifetime study in advanced isolation techniques

Poyai, Amporn; Simoen, Eddy; Claeys, C.; Rooyackers, Rita; Badenes, Gonçal (2000)

a-SiN:H thin film diode for digital radiography

Popov, I.; Van Doorselaer, Geert; Van Calster, Andre; De Smet, Herbert; De Baets, Johan; Callens, F.; Boesman, E. (2000)

Presentations: Recent submissions

Defining the rationale for moving restoration and protection up to the MPLS layer ﻿

Design experiment for measurement and modeling of digital substrate noise generation ﻿

Analog addressed microdisplays ﻿

Development of generic technologies for the realisation of long wavelength photonic integrated circuits ﻿

The use of convergent beam electron diffraction for stress measurements in shallow trench isolation structures ﻿

Material characteristics and damascene patterning of a fluoropolymer low-k film ﻿

Stress build-up during the Ni-silicidation in and around narrow silicide lines ﻿

Orientation dependent stress build-up during the formation of epitaxial CoSi2 ﻿

Transfer of a thin porous silicon layer on foreign substrate ﻿

Defect analysis of n-type silicon strained layers ﻿

Chemical mapping of V-defects in InGaN MQWs ﻿

Effect of HF solution on the porous structure of low-k SICOH film ﻿

Effect of deposition and annealing temperature on the structural and mechanical properties of poly SiGe ﻿

Modeling of electromigration in interconnects ﻿

Properties of TiN thin films deposited by ALCVD as barriers for Cu metallization ﻿

Reticle status and issues for application in advanced 193 nm lithography ﻿

Advanced application of the field equivalence principle in boundary integral equation and hybrid formulations ﻿

The work of the GOOD-DIE II network of excellence in Europe on the infrastructure for semiconductor technologies ﻿

Lifetime study in advanced isolation techniques ﻿

a-SiN:H thin film diode for digital radiography ﻿