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Diffusion and adhesion issues of low permittivity dielectrics with copper for high performance interconnects

dc.contributor.authorLanckmans, Filip
dc.date.accessioned2021-10-14T22:07:53Z
dc.date.available2021-10-14T22:07:53Z
dc.date.issued2002-03
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6513
dc.sourceIIOimport
dc.titleDiffusion and adhesion issues of low permittivity dielectrics with copper for high performance interconnects
dc.typePHD thesis
dc.source.peerreviewno
dc.contributor.thesisadvisorMaex, Karen
dc.contributor.thesisadvisorCelis, Jean-Pierre
imec.availabilityPublished - imec


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