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Stress evaluation in packaging using Raman spectroscopy and finite element simulation

dc.contributor.authorChen, Jian
dc.date.accessioned2021-10-15T12:50:59Z
dc.date.available2021-10-15T12:50:59Z
dc.date.issued2004-04
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8671
dc.sourceIIOimport
dc.titleStress evaluation in packaging using Raman spectroscopy and finite element simulation
dc.typePHD thesis
dc.source.peerreviewno
dc.contributor.thesisadvisorSilverans, R.
dc.contributor.thesisadvisorDe Wolf, Ingrid
imec.availabilityPublished - imec


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