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Integration issues of CMP

dc.contributor.authorRobinson, K.M.
dc.contributor.authorDevriendt, Katia
dc.contributor.authorEvans, D.R.
dc.date.accessioned2021-10-15T15:50:59Z
dc.date.available2021-10-15T15:50:59Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9514
dc.sourceIIOimport
dc.titleIntegration issues of CMP
dc.typeBook chapter
dc.contributor.imecauthorDevriendt, Katia
dc.contributor.orcidimecDevriendt, Katia::0000-0002-0662-7926
dc.source.peerreviewno
dc.source.beginpage351
dc.source.bookChemical-Mechanical Planarization of Semiconductor Materials
dc.source.endpage418
imec.availabilityPublished - imec
imec.internalnotesSpringer Series in Materials Science; Vol. 69


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